The definitive technical advantage of a 20 MHz high-frequency band in HIFU treatments is the creation of an exceptionally small and precise focal point. While lower frequencies (1-5 MHz) are designed to penetrate deeply with a broader focus, a 20 MHz system concentrates energy into a tight volume, allowing for micron-level accuracy within the skin’s epidermal and dermal layers.
Core Takeaway: While low-frequency ultrasound prioritizes depth, 20 MHz high-frequency HIFU prioritizes resolution and containment. By generating highly localized thermal and mechanical effects, this specific frequency maximizes cure rates for superficial conditions while drastically reducing the risk of scarring or collateral damage to surrounding healthy tissue.
The Mechanics of High-Frequency Precision
The Relationship Between Frequency and Focal Size
In ultrasound physics, there is an inverse relationship between frequency and wavelength.
A 20 MHz frequency generates a much shorter wavelength than standard 1-5 MHz systems. This physical property allows the device to focus ultrasound waves into a significantly smaller focal point.
Micron-Level Ablation
Because the focal point is so tight, the energy does not disperse over a large area.
This enables micron-level tissue ablation, meaning the practitioner can target specific microscopic structures within the skin. This level of granularity is impossible with lower frequencies, which produce a larger, more diffuse "lesion" volume.
Clinical Implications for Dermatology
Controlled Thermal and Mechanical Effects
The 20 MHz band generates both thermal (heat) and mechanical (vibration/cavitation) stress, but keeps these effects strictly localized.
This containment ensures that the biological response—whether it is collagen stimulation or tissue destruction—occurs exactly where intended. It prevents energy from "bleeding" into areas where it isn't needed.
Minimizing Collateral Damage
The primary risk in HIFU treatments is inadvertent damage to healthy tissue, which can lead to scarring.
Because 20 MHz systems limit their impact to the target zone, there is minimal risk of damage to adjacent healthy tissues. This precision is critical when treating delicate areas of the face or when the goal is cosmetic improvement without visible scarring.
Understanding the Trade-offs
Depth Limitation
It is important to understand the limitation of high-frequency sound waves: attenuation.
Higher frequencies (20 MHz) are absorbed more quickly by tissue and cannot penetrate as deeply as 1-5 MHz frequencies. Therefore, 20 MHz is excellent for surface skin concerns but ineffective for deep tissue lifting (SMAS layer) or fat reduction, which require the deeper penetration of low-frequency waves.
Making the Right Choice for Your Goal
To select the correct HIFU frequency, you must match the technical capability of the band to the depth of the pathology you are treating.
- If your primary focus is superficial skin treatment: Use 20 MHz to achieve high cure rates for epidermal and dermal issues with minimal scarring risks.
- If your primary focus is deep tissue lifting: Rely on lower frequencies (1-5 MHz) to bypass the skin layers and deposit energy into deeper structural zones.
Precision in frequency selection is the single most important factor in ensuring both safety and efficacy in HIFU procedures.
Summary Table:
| Feature | 20 MHz High-Frequency HIFU | 1-5 MHz Low-Frequency HIFU |
|---|---|---|
| Focal Point Size | Exceptionally small / Micron-level | Broader / Diffuse |
| Penetration Depth | Superficial (Epidermis/Dermis) | Deep (SMAS / Subcutaneous Fat) |
| Primary Benefit | High resolution & containment | Deep tissue lifting & volume reduction |
| Collateral Risk | Minimal risk to surrounding tissue | Higher risk of unintended heat spread |
| Main Application | Fine lines, skin texture, precision ablation | Face lifting, body contouring |
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References
- Jacek Calik, Natalia Sauer. Healing Process after High-Intensity Focused Ultrasound Treatment of Benign Skin Lesions: Dermoscopic Analysis and Treatment Guidelines. DOI: 10.3390/jcm13040931
This article is also based on technical information from Belislaser Knowledge Base .
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