Knowledge fractional co2 laser machine Why is 50 J pulse energy required for Fractional CO2 laser? Master Scar & Ulcer Treatment
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Tech Team · Belislaser

Updated 2 weeks ago

Why is 50 J pulse energy required for Fractional CO2 laser? Master Scar & Ulcer Treatment


High pulse energy is essential to mechanically disrupt the physical barriers that prevent healing. Standard energy levels often fail to penetrate thick, hardened scar tissue; high settings (such as 50 mJ/J) provide the necessary force to reach the deep dermis, releasing the tension that holds ulcers open.

The Core Mechanism Chronic ulcers and limited scars are often maintained by rigid, contracted tissue deep beneath the skin's surface. High pulse energy allows the laser to bypass surface layers and physically break this "armored" tension, eliminating the traction pulling the wound edges apart and creating the conditions required for closure.

Overcoming the Physical Barrier

Penetrating Hardened Tissue

Scar tissue is significantly denser and more fibrous than healthy skin, acting almost like a shield against treatment. High pulse energy is required to drive the laser beam through this thickened, cord-like tissue effectively. Without sufficient energy, the laser would only impact the surface, leaving the underlying structural problems untouched.

Reaching the Deep Dermis

The root cause of non-healing ulcers and restricted mobility often lies in the deep dermis. High energy settings ensure the laser creates micro-channels that are deep enough to access these lower layers. This depth is critical for delivering therapeutic effects exactly where the collagen matrix is misaligned.

The Mechanism of Tension Release

Photomechanical Tension Release

The primary reference highlights that deep ablation produces immediate photomechanical tension release. Imagine a tight rubber band holding a wound open; the laser effectively "snaps" these microscopic bands. This mechanical release is immediate and necessary for modifying the physical structure of the scar.

Eliminating Mechanical Traction

Ulcers often fail to heal because scar contracture creates constant pulling forces (traction) at the wound edges. By using high energy to ablimate the deep scar tissue, this traction is eliminated. Once the physical pulling force is removed, the skin edges can relax and migrate together to close the ulcer.

Biological Activation and Remodeling

Triggering the Healing Cascade

Beyond the physical release of tension, the laser creates Microscopic Thermal Zones (MTZs). These deep injuries stimulate a potent biological response, upregulating procollagen messenger RNA and cytokines. This essentially "wakes up" the cellular repair mechanisms that had become dormant in the chronic wound.

Preserving a Cellular Reservoir

While high energy is used to destroy scar tissue, the fractional nature of the laser leaves bridges of healthy tissue intact. These undamaged areas act as a cellular reservoir, providing the biological materials needed to rapidly fill the deep micro-channels created by the high-energy pulse.

Understanding the Trade-offs

Balancing Depth vs. Safety

While high energy (e.g., 50 mJ) is needed for depth, it increases the risk of thermal damage if not managed correctly. The "deep mode" must be balanced with fractional density (the spacing between spots). Lower density is often paired with higher energy to ensure there is enough healthy tissue left to support recovery.

The Risk of Heat Accumulation

High pulse energy generates significant heat. If the dwell time (how long the laser stays in one spot) is too long, it can cause excessive lateral thermal damage. Operators must precisely control these parameters to ensure the laser vaporizes the scar tissue without burning the surrounding healthy nail bed or skin folds.

Making the Right Choice for Your Goal

The specific settings you choose depend heavily on the pathology you are treating.

  • If your primary focus is releasing scar contracture (mobility): Prioritize high pulse energy to penetrate deep into the dermis and mechanically sever the tension bands restricting movement.
  • If your primary focus is surface texture or mild scarring: Lower pulse energy with higher density is often preferred to refine the surface without unnecessary depth, reducing recovery time.
  • If your primary focus is chronic ulcer closure: Use high energy in a low-density fractional pattern to release deep tension while preserving enough healthy "bridges" to fuel rapid epithelial repair.

High pulse energy is not just about power; it is the specific tool required to mechanically free the skin from the deep, rigid grip of chronic scarring.

Summary Table:

Feature High Energy (e.g., 50mJ/J) Low/Standard Energy
Primary Goal Deep scar release & ulcer closure Surface texture & pigmentation
Penetration Depth Deep dermis (reaches root of scar) Epidermis & upper dermis
Mechanical Effect Snaps deep tension bands (Traction release) Minor thermal remodeling
Tissue Response Strong biological healing cascade Superficial cellular turnover
Target Tissue Rigid, fibrous, or non-healing tissue Mild acne scars or fine lines

Elevate your clinic's clinical outcomes with BELIS. As specialists in professional-grade medical aesthetic equipment, we provide advanced CO2 Fractional laser systems, Nd:YAG, and Pico lasers designed to tackle the most challenging skin conditions like chronic scars and non-healing ulcers. Our portfolio also features high-performance HIFU, Microneedle RF, and body sculpting solutions including EMSlim and Cryolipolysis, ensuring your premium salon or clinic offers the gold standard in patient care. Contact our experts today to upgrade your technology and bring transformative results to your clients.

References

  1. Cynthia L. Nicholson, David Ozog. Rapid healing of chronic ulcerations and improvement in range of motion after fractional carbon dioxide (CO2) treatment after CO2 excision of hidradenitis suppurativa axillary lesions: A case report. DOI: 10.1016/j.jdcr.2015.11.001

This article is also based on technical information from Belislaser Knowledge Base .

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